G-Lon Reballing Stencil and Solder Paste for iPhone X/XS/MAX158℃
Description
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G-Lon Reballing Stencil and Solder Paste for iPhone X/XS/MAX 158℃
Description:
G-Lon iPhone X XS MAX Middle Board BGA Reballing Stencil Set + iPhone X XS MAX Solder Paste, G-Lon Phone College iPhone X Middle Layer BGA Reballing Fixture with Special Solder Paste.
2pcs G-Lon iPhone X / XS XS MAX Middle Board BGA Reballing Stencil Set + Solder Paste
Features:
This set of tools breaks through the problem of low success rate of traditional mainboard repairing.
Greatly reduced the difficulty of iphone X motherboard maintenance.
The mystery lies in professionalism of the soldering paste. There is no different between this product and original middle layer tin.The tin melting point of the CPU area is slightly lower than the that of surrounding.
This solder paste uses the principle of temperature difference, Easily blow CPU without touching the peripheral accessories.
Within the fine temperature difference,Makes the entire maintenance efficiency greatly improved.
Even green hands can plant tin perfectly.
Product Specification:
Size: 15.5*8*3.5cm.
Weight: 0.4kg.
Color: Silver.
Aapplication: for iPhone Logic Board Repairing.
Function: Motherboard Repair Planting Tin Fixture for iPhone.
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Packing
Original package + carton box
After-sale service
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