The BGA reballing fixture - Z13 is professional BGA reballing stencil fixture for iPhone X/XS/XS Max, iPhone X/XS/XS Max motherboard BGA reballing fixture tool, it is used for positioning and reballing iPhone X/XS/XS Max PCB BGA parts, convenient and faster for reballing BGA without any damage. The BGA reballing fixture - Z13 for iPhone X/XS/XS Max is a professional BGA reballing stencil fixture for iPhone.
Specifications
Size: 10*8*0.4 cm (L*W*H)
Weight: 1 KG
For iPhone X/XS/XS Max
● The BGA reballing fixture - Z13 is equipped with middle layer and radiofrequency BGA reball stencil for iPhone X/XS /XS Max.
● The BGA reballing fixture - Z13 for iPhone X/XS/XS Max's positioning column is fixed and aligned accurately.
● The BGA reballing fixture - Z13 can reballing and repairing iPhone X/XS/XS Max's BGA without any damage, and square openings, tin beads uniform.
● Install the iPhone X/XS/XS Max main board on the platform.
● Cover the iPhone X/XS/XS Max BGA reballing stencil on mainboard.
● Evenly spread tin on the cover of the reballing stencil.
● Remove the reballing stencil cover.
● Take out the motherboard and cooperate with the hot air gun to solidify the tin point.
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Original package + carton box
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