MJ 3D BGA Reballing Stencil For iPhone 6~ iPhone 11 Pro Max
Description
Reviews
MJ 3D BGA Reballing Stencil For iPhone 6~ iPhone 11 Pro Max
Compatibility
For iPhone 6~ iPhone 11 Pro Max
Features
High-quality steel sheet stencil, more durable
Precise laser cutting for better alignment
High-temperature resistance, not easy to get deformed
The CPU and the common fault ICs are integrated into one stencil
IC numbers are lasered on the stencil for reference, much easier to find
Purchase by set to save 5%
You can also purchase separately if you do not need all, this set includes
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Packing
Original carton box packing
Tips for Installation
● Special tooling is required when BGA reballing the IC chips and CPU
● The installation of any new parts should be done by a qualified person. we are not responsible for any damage caused during installation.
After-sale service
Please feel free to contact us for any problems at any time: service@fanscreate.com
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