X
Your position: Home / Repair Tools / Solder Tools & Materials / Reball Stencils

MJ A11 3D BGA Reballing Stencil For iPhone 8/8+/X

Price:
USD
$10.58
    Please select the information you wantX
Quantity:
-
+
(1000 available)
Shipping Cost:
to
Estimated Delivery Time:
Please select the country you want to ship from
Inquiry Now
Add to Favorite Items
  • Description
  • Reviews
MJ  A11 3D BGA Reballing Stencil For iPhone 8/8+/X

Compatibility
For iPhone 8/8+/X

Features
  • High-quality steel sheet stencil, more durable
  • Precise laser cutting for better alignment
  • High-temperature resistance, not easy to get deformed
  • The CPU and the common fault ICs are integrated into one stencil
  • IC numbers are lasered on the stencil for reference, much easier to find

________________________________________________________________________________________________________________

Packing
Original carton box packing

Tips for Installation
●  Special tooling is required when GBA reballing the IC chips and CPU
● The installation of any new parts should be done by a qualified person. Fanscreate is not responsible for any damage caused during installation.

After-sale service
Please feel free to contact us for any problems at any time: service@fanscreate.com
Average rating:
Share your thoughts with other customers
Write a review
Product reviews can be carried out after the member login, please click here to login
Susi
Message Us