The motherboard disassembles platform heating groove For iPhone 11/11 PRO/11 PRO MAX - T12A -N11 is suitable For iPhone 11/11 PRO/11 PRO MAX Mas motherboard
repair heating disassembly, CPU, and other components heating degumming. It is matched with the Motherboard Disassemble Platform Main Unit - SS-T12A.
This item is just including the iPhone 11/11 PRO/11 PRO MAX motherboard heating groove, not including the heating station's main unit.
● Model: T12A -N11
● Motherboard heating groove size: 126*72*18mm (L*W*H)
● Temperature: 100-280℃
For iPhone 11/11 PRO/11 PRO MAX
Features
● The motherboard disassembles the platform heating groove including the heating area For iPhone 11/11 PRO/11 PRO MAX, CPU glue removal area.
● The motherboard disassembles the platform heating groove iPhone 11/11 PRO/11 PRO MAX is only heating the middle column, without heating the CPU.
● Silicone insulation, high-temperature resistance, lowering the temperature of the bottom contact surface.
● High-purify copper is used as the contact surface to ensure uniform heat transfer and heat.
Original package + carton box
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