Motherboard Disassemble Platform Heating Groove for iPhone XS/XS Max/XR - T12A - XF
Description
The platform heating and softening glue, efficient frame removal, heating parts, safe and practical, easy to operate. Efficient removal of the mobile frame.
This item is just including the T12A - XF motherboard heating groove, not including the heating station's main unit.
● Model: T12A -XF
● Motherboard heating groove size: 126*72*18mm (L*W*H)
● Temperature: 100-160℃
For T12A-XF
1. Simple operation, small and portable, accurate card position efficient quick release
2: suitable for iPhone X XR XS XMAX
3.heating temperature is limited to below 160°C
4. Silicone insulation, high-temperature resistance, lowering the temperature of the bottom contact surface.
5. High-purify copper is used as the contact surface to ensure uniform heat transfer and heat.
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Original package + carton box
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