The motherboard disassembles the platform heating groove for mobile phone - T12A - CPU including heating area, Silicone insulation, High purity copper film.
Note
This item is just including the mobile phone - T12A - CPU motherboard heating groove, not including the heating station's main unit.
● Model: T12A - CPU
● motherboard heating groove size: 126*72*18 mm (L*W*H)
● Net weight: 289 g
● Temperature: 100-280℃
For Mobile Phone
● Accurate temperature control and temperature adjustable.
● Offers heat evenly to protect the motherboard from damage.
● High purity copper is used as a film to ensure uniform heat transfer and heat.
Original package + carton box
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