The RMA-223-UV needles BGA flux paste is a high viscosity no-clean flux, it can be used for PCB, BGA, PGA reworking, and soldering and reballing
of computer and mobile phone chips. The needles BGA flux paste is matched with a 5ml syringe.
● Volume : 1 ×10ml/10cc
● Material: tin+solder paste
● Store: shady or refrigerated environment for 12 months
Features
The needles BGA flux paste RMA-223-UV is the mixture of high-quality alloyed powder and resinous pasty flux, it can avoid the pale yellow residue, so you are
easy to clean the board.
Packing
Zip-lock bag + carton box
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